Tongqing Wang

发表

Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Process

S. Lim, Jie Cheng, Xinchun Lu, 2017, IEEE Transactions on Semiconductor Manufacturing.

Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS

Tongqing Wang, Chao Chen, Linsong Wang, 2016 .

Role of the Adhesion Force during Copper Chemical Mechanical Planarization

Jie Cheng, Tongqing Wang, Li Jianlin, 2018 .

Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers

Xinchun Lu, Tongqing Wang, Lifei Zhang, 2020, Journal of Materials Science.

Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium

Jie Cheng, Xinchun Lu, Tongqing Wang, 2016 .

An In Situ End-Point Detection System Using Motor Power Signal for Chemical Mechanical Planarization Process

Hong Li, Jianbin Luo, Xinchun Lu, 2017 .

Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry

Jie Cheng, Xinchun Lu, Wenbin Zhou, 2014 .

Effects of catalyst concentration and ultraviolet intensity on chemical mechanical polishing of GaN

Xinchun Lu, G. Pan, Tongqing Wang, 2016 .

The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning

Xinchun Lu, Tongqing Wang, Lifei Zhang, 2019, Microelectronic Engineering.

Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling

Jianbin Luo, Xinchun Lu, Tongqing Wang, 2013 .

A kinematic model describing particle movement near a surface as effected by Brownian motion and electrostatic and Van der Waals forces

Jie Cheng, Xinchun Lu, Tongqing Wang, 2014 .

Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing

Jie Cheng, J. Pan, Xinchun Lu, 2016, Journal of Electronic Materials.

RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis

Jie Cheng, Xinchun Lu, Shuo Huang, 2020 .

Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry

Xinchun Lu, Yongyong He, Tongqing Wang, 2015 .

Surface characteristics of ruthenium in periodate-based slurry during chemical mechanical polishing

Jie Cheng, Xinchun Lu, Tongqing Wang, 2015 .

Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy

Xinchun Lu, Tongqing Wang, Lile Xie, 2021 .

Effect of slurry injection position on material removal in chemical mechanical planarization

Yongyong He, Xinchun Lu, Tongqing Wang, 2013 .

Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer

Xinchun Lu, Yongyong He, Tongqing Wang, 2013 .

Effects of the Polishing Variables on the Wafer-Pad Interfacial Fluid Pressure in Chemical Mechanical Polishing of 12-Inch Wafer

Yongyong He, Jianbin Luo, Xinchun Lu, 2012 .

Numerical and experimental investigation on multi-zone chemical mechanical planarization

Xinchun Lu, Tongqing Wang, 2011 .

A kinematic model describing particle movement near a surface as effected by Brownian motion and electrostatic and Van der Waals forces

Xinchun Lu, Tongqing Wang, Dewen Zhao, 2014, Science China Technological Sciences.

Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories

Yongyong He, Xinchun Lu, Tongqing Wang, 2013, IEEE Transactions on Semiconductor Manufacturing.

Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry

Xinchun Lu, Tongqing Wang, Jie Cheng, 2015, Tribology Letters.

Effect of slurry injection position on material removal in chemical mechanical planarization

Yongyong He, Xinchun Lu, Tongqing Wang, 2013, The International Journal of Advanced Manufacturing Technology.

Micro-galvanic corrosion of Cu/Ru couple in potassium periodate (KIO 4 ) solution

Jie Cheng, J. Pan, Xinchun Lu, 2018, Corrosion Science.

Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process

Yongyong He, Xinchun Lu, Tongqing Wang, 2013 .

Effect of photocatalytic oxidation technology on GaN CMP

Xinchun Lu, Tongqing Wang, Jie Cheng, 2015, 2015 International Conference on Planarization/CMP Technology (ICPT).

Investigating the impact of regional transport on PM 2.5 formation using vertical observation during APEC 2014 Summit in Beijing

Shuxiao Wang, Yu Song, Tianshu Zhang, 2016 .

Effect of a Cu seed layer on electroplated Cu film

Xinchun Lu, Tongqing Wang, Yuhong Liu, 2013 .

Chemical Mechanical Polishing of Inlaid Copper Structures with Ru/Ta/TaN as Barrier/Liner Layer

Jie Cheng, Xinchun Lu, Tongqing Wang, 2018 .

Synthesis of CeO_2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing

Xinchun Lu, Zhenyang Wang, Tongqing Wang, 2023, Electronic Materials Letters.

A theoretical model incorporating both the nano-scale material removal and wafer global uniformity during planarization process

Jie Cheng, Tongqing Wang, Jing Li, 2017 .

Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing

Yongyong He, Xinchun Lu, Tongqing Wang, 2017 .

Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing

Yongyong He, Jianbin Luo, Xinchun Lu, 2013 .

Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process

Yongyong He, Xinchun Lu, Tongqing Wang, 2013 .

Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing

Yongyong He, Xinchun Lu, Tongqing Wang, 2012, IEEE Transactions on Semiconductor Manufacturing.

Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization

Xinchun Lu, Tongqing Wang, Xinchun Lu, 2016 .

Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters

Tongqing Wang, Dewen Zhao, Zhimin Chai, 2023, Advanced science.

Metal Thickness Measurement System Based on a Double-Coil Eddy-Current Method With Characteristic Ratio Detection

Xinchun Lu, Tongqing Wang, Chengxin Wang, 2023, IEEE transactions on industrial electronics (1982. Print).

In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone

Xinchun Lu, Tongqing Wang, Yonggang Meng, 2013 .

Use of AIS data for performance evaluation of ship traffic with speed control

Zaili Yang, Likun Wang, Lei Fu, 2020, Ocean Engineering.