Xiao-peng Wang

Multiphysics Characterization of Transient Electrothermomechanical Responses of Through-Silicon Vias Applied With a Periodic Voltage Pulse

Sailing He, W. Yin, Xiao-peng Wang, 2010, IEEE Transactions on Electron Devices.

Frequency- and Temperature-Dependent Modeling of Coaxial Through-Silicon Vias for 3-D ICs

W. Yin, Wensheng Zhao, Xiao-peng Wang, 2011, IEEE Transactions on Electron Devices.