R. Ding

发表

Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits

Yintang Yang, Yuejin Li, Zhangming Zhu, 2016 .

A Model of Air-Gap Through-Silicon Vias (TSVs) for Microwave Applications

Yintang Yang, Zhangming Zhu, Xiaoxian Liu, 2015, IEEE Microwave and Wireless Components Letters.

A novel split capacitor array switching scheme with proportional coefficient for SAR ADC

Zhangming Zhu, R. Ding, Shubin Liu, 2019, Analog Integrated Circuits and Signal Processing.

A 99.77% energy-reduced asymmetric capacitance switching scheme for SAR ADC with split-capacitor method

Zhangming Zhu, R. Ding, Shubin Liu, 2018, Analog Integrated Circuits and Signal Processing.

99.2% energy saving and high-linearity switching method for SAR ADCs

Zhangming Zhu, R. Ding, Jin Zhang, 2017 .

99.8% energy saving and 97.4% area reduction switching scheme for SAR ADCs

Zhangming Zhu, R. Ding, Donglin Zhu, 2017 .

High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects

Yintang Yang, Yuejin Li, Zhangming Zhu, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias

Yintang Yang, Yuejin Li, Zhangming Zhu, 2017, IEEE Transactions on Nanotechnology.

Type of distortionless through silicon via design based on the multiwalled carbon nanotube

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2013 .

Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits

Yintang Yang, Yinshui Xia, Libo Qian, 2014 .

Performance analysis of single-walled carbon nanotube bundle interconnects for three-dimensional integration applications

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2013 .

Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2014, IEEE Microwave and Wireless Components Letters.

Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2014, IEICE Electron. Express.

Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV)

Fengjuan Wang, Yintang Yang, Zhangming Zhu, 2013, IEICE Electron. Express.

Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2017, IEEE Microwave and Wireless Components Letters.

ParasiticInductanceofNon-UniformThrough-Silicon

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2015 .

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits

Fengjuan Wang, Yintang Yang, Ruixue Ding, 2013, IEICE Electron. Express.

Transport properties of boron-doped single-walled silicon carbide nanotubes

Yintang Yang, R. Ding, J. X. Song, 2011 .

SEMICONDUCTOR DEVICES: Working mechanism of a SiC nanotube NO2 gas sensor

Yintang Yang, Liu Lianxi, Rui-Xue Ding, 2009 .

High-Frequency Electrical Modeling and Characterization of Differential TSVs for 3-D Integration Applications

Zhangming Zhu, Ruixue Ding, Chenbing Qu, 2017, IEEE Microwave and Wireless Components Letters.

First-principles study of boron doping-induced band gap narrowing in 3C-SiC

Yintang Yang, R. Ding, Xiaowen Xi, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

A 10-Bit 600-MS/s Time-Interleaved SAR ADC With Interpolation-Based Timing Skew Calibration

Nan Sun, Yintang Yang, Zhangming Zhu, 2019, IEEE Transactions on Circuits and Systems II: Express Briefs.

A 9.1ENOB 200MS/s Asynchronous SAR ADC With Hybrid Single-Ended/Differential DAC in 55-nm CMOS for Image Sensing Signals

Zhangming Zhu, Yuhua Liang, Ruixue Ding, 2018, IEEE Sensors Journal.

An 8-Bit 2.1-mW 350-MS/s SAR ADC With 1.5 b/cycle Redundancy in 65-nm CMOS

Maliang Liu, Zhangming Zhu, Dengquan Li, 2020, IEEE Transactions on Circuits and Systems II: Express Briefs.

Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2015, IEEE Transactions on Electron Devices.

Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs)

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2016, IEEE Microwave and Wireless Components Letters.

Parasitic Inductance of Non-Uniform Through-Silicon Vias (TSVs) for Microwave Applications

Yintang Yang, Zhangming Zhu, Ruixue Ding, 2015, IEEE Microwave and Wireless Components Letters.

A Power-Efficient TVC-Based Fast Auto-Frequency Calibration for PLLs

R. Ding, Shubin Liu, Dengquan Li, 2022, IEEE Transactions on Circuits and Systems - II - Express Briefs.

Energy-efficient and area-efficient tri-level floating capacitor switching scheme for SAR ADC

Zhangming Zhu, Hao Wang, Ruixue Ding, 2015 .

Thermo-mechanical characterization of single-walled carbon nanotube (SWCNT)-based through-silicon via (TSV) in (100) Silicon

Yintang Yang, Zhangming Zhu, R. Ding, 2015 .

Modeling and Optimization of Multiground TSVs for Signals Shield in 3-D ICs

Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, 2017, IEEE Transactions on Electromagnetic Compatibility.

First-Principles Study of Adsorption Properties of NO2 on Boron-Doped Silicon Carbide Nanotube

Yintang Yang, R. Ding, J. Song, 2011 .