P. Dixit

发表

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

R. Tummala, Xi Liu, Qiao Chen, 2009, 2009 59th Electronic Components and Technology Conference.

High Aspect Ratio Glass Micromachining by Multi-Pass Electrochemical Discharge Based Micromilling Technique

D. K. Mishra, P. Dixit, J. Arab, 2019, ECS Journal of Solid State Science and Technology.

Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias

Rao Tummala, Jianmin Miao, Ritwik Chatterjee, 2008 .

Fabrication of high aspect ratio 35 /spl mu/m pitch interconnects for next generation 3-D wafer level packaging by through-wafer copper electroplating

P. Dixit, J. Miao, Jianmin Miao, 2006, 56th Electronic Components and Technology Conference 2006.

Silicon nanopillars based 3D stacked microchannel heat sinks concept for enhanced heat dissipation applications in MEMS packaging

Jianmin Miao, Nay Lin, Teo Kiat Choon, 2008 .

Numerical and experimental investigations into microchannel formation in glass substrate using electrochemical discharge machining

D. K. Mishra, P. Dixit, D. Marla, 2019, Journal of Micromechanics and Microengineering.

Eigenfrequency Investigation of SU-8 Single Axis MEMS Piezoresistive Accelerometers

Rajul S. Patkar, M. Baghini, B. Mezghani, 2020, 2020 IEEE International Conference on Design & Test of Integrated Micro & Nano-Systems (DTS).

Evaluation of small scale n‐heptane fire extinguishing efficacy by natural antioxidants based pyrotechnic compositions: An experimental study

P. Dixit, Vandana Sharma, Tribhuvan Kumar Pathak, 2020, Fire and Materials.

Aerosol Forming Compositions for Fire Fighting Applications: A Review

M. Rohilla, R. Narang, A. Saxena, 2019, Fire Technology.

Experimental and Theoretical Dynamic Investigation of MEMS Polymer Mass-Spring Systems

Rajul S. Patkar, M. Baghini, B. Mezghani, 2020, IEEE Sensors Journal.

Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications

D. K. Mishra, P. Dixit, Tarlochan Singh, 2021, Materials and Manufacturing Processes.

Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating

J. Miao, P. Dixit, 2006 .

Via Technologies for MEMS

K. Henttinen, P. Dixit, 2015 .

Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects

J. Miao, J. Pang, Luhua Xu, 2007 .

Mechanical and Microstructural Characterization of Through-Silicon Via Fabricated with Constant Current Pulse-Reverse Modulation

J. Miao, P. Dixit, Nay Lin, 2010 .

Effect of Process Gases on Fabricating Tapered Through-Silicon vias by Continuous SF6/O2/Ar Plasma Etching

P. Dixit, J. Salonen, P. Monnoyer, 2012 .

Surfactant‐Free One‐Pot Synthesis of Low‐Density Cerium Oxide Nanoparticles for Adsorptive Removal of Arsenic Species

A. Saxena, P. Mishra, Rakesh Kumar, 2018 .

Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

Jianmin Miao, Nay Lin, Pradeep Dixit, 2013, Microelectron. Reliab..

Influence of tool electrode feed rate in the electrochemical discharge drilling of a glass substrate

P. Dixit, J. Arab, 2020 .

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging

P. Dixit, H. K. Kannojia, 2021, Journal of Materials Science: Materials in Electronics.

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Jianmin Miao, John H. L. Pang, Robert Preisser, 2007 .

Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper

J. Miao, K. Tu, J. Pang, 2008 .

A review on microholes formation in glass-based substrates by electrochemical discharge drilling for MEMS applications

P. Dixit, Tarlochan Singh, J. Arab, 2022, Machining Science and Technology.

Characterization of Nano-grained High Aspect Ratio Through-wafer Copper Interconnect Column

K. Tu, J. Pang, Luhua Xu, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks

P. Dixit, H. K. Kannojia, 2019 .

Fabrication & characterization of high aspect ratio fine pitch deep reactive ion etched through-wafer electroplated copper interconnects.

P. Dixit, 2008 .

Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating

J. Miao, J. Pang, Luhua Xu, 2007 .

Micro array hole formation in glass using electrochemical discharge machining

D. K. Mishra, P. Dixit, J. Arab, 2019, Procedia Manufacturing.

Experimental investigations of energy channelization behavior in ultrasonic assisted electrochemical discharge machining

A. Dvivedi, P. Dixit, Tarlochan Singh, 2021, Journal of Materials Processing Technology.

Through-holes micromachining of alumina using a combined pulse-feed approach in ECDM

P. Dixit, Priyaranjan Sharma, J. Arab, 2021 .

Surface finishing of an additively manufactured part using electrochemical jet machining

Pravin Kumar, N. Jain, P. Dixit, 2023, Materials Today Communications.

Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking

Jianmin Miao, Robert Preisser, Pradeep Dixit, 2006 .

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

P. Dixit, Karan Pawar, 2022, Surface Engineering.

Fabrication of Through-glass Vias (TGV) based 3D microstructures in Glass Substrate by a lithography-free process for MEMS applications

P. Dixit, Vishnu Kant Bajpai, Dileep Kumar Mishra, 2022, Applied Surface Science.

Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging

P. Dixit, H. Pandey, Tarlochan Singh, 2022, Materials Letters.

Effect of tool-electrode material in through-hole formation using ECDM process

P. Dixit, J. Arab, Karan Pawar, 2021 .

Effect of Tool Electrode-Workpiece Gap in the Microchannel Formation by Electrochemical Discharge Machining

D. K. Mishra, P. Dixit, Karan Pawar, 2020 .

Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications

D. K. Mishra, P. Dixit, A. Verma, 2020 .

Fabrication of Deep Microfeatures in Glass Substrate using Electrochemical Discharge Machining for Biomedical and Microfluidic Applications

D. K. Mishra, P. Dixit, J. Arab, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Effect of Clamping Ring Materials and Chuck Temperature on the Formation of Silicon Nanograss in Deep RIE

J. Miao, P. Dixit, 2006 .

Effect of SF 6 flow rate on the etched surface profile and bottom grass formation in deep reactive ion etching process

Jianmin Miao, Pradeep Dixit, J. Miao, 2006 .

Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate

P. Dixit, Shalabh Gupta, Ambika Shanker Shukla, 2021, Microsystem Technologies.

Through-substrate vias based three-dimensional interconnection technology

K. Henttinen, P. Dixit, H. K. Kannojia, 2020 .

Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling

D. K. Mishra, P. Dixit, J. Arab, 2021 .

Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM

P. Dixit, J. Arab, H. K. Kannojia, 2019, Precision Engineering.

Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining

P. Dixit, J. Arab, Ritesh Kumar, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding

P. Dixit, H. K. Kannojia, 2019, Journal of Materials Science: Materials in Electronics.

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

Tapani Vehmas, Sami Vähänen, Kimmo Henttinen, 2012 .

Effect of improved wettability of silicon-based materials with electrolyte for void free copper deposition in high aspect ratio through-vias

J. Miao, P. Dixit, X. Chen, 2008 .

Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating

Jianmin Miao, Sheeja Divakaran, Robert Preisser, 2007 .

Investigation of Carbon Nanotube Growth on Multimetal Layers for Advanced Interconnect Applications in Microelectronic Devices

J. Miao, Sam Zhang, P. Dixit, 2009 .

Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining

D. K. Mishra, P. Dixit, J. Arab, 2019, Journal of Applied Electrochemistry.

Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging

D. K. Mishra, P. Dixit, J. Arab, 2019, Journal of Materials Processing Technology.

Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process

D. K. Mishra, P. Dixit, 2021, Journal of Manufacturing Processes.

Formation of macro-sized through-holes in glass using notch-shaped tubular electrodes in electrochemical discharge machining

P. Dixit, J. Arab, 2022, Journal of Manufacturing Processes.

Investigation of tool wear in alumina micromachining by multi-tip ECDM

P. Dixit, Priyaranjan Sharma, 2021, Materials and Manufacturing Processes.

Role of tool-substrate gap in the micro-holes formation by electrochemical discharge machining

D. K. Mishra, P. Dixit, J. Arab, 2020, Procedia Manufacturing.

High Aspect Ratio Vertical Through-Vias for 3D MEMS Packaging Applications by Optimized Three-Step Deep RIE

Jianmin Miao, Pradeep Dixit, J. Miao, 2008 .

The application of dry photoresists in fabricating cost-effective tapered through-silicon vias and redistribution lines in a single step

P. Dixit, J. Salonen, P. Monnoyer, 2011 .

Effect of Tool Path Complexity on Top Burrs in Micromilling

Suhas S. Joshi, Pradeep Dixit, Alwin Varghese, 2019, Procedia Manufacturing.

Role of process gases in making tapered through-silicon vias for 3D MEMS packaging

P. Dixit, J. Salonen, S. Vahanen, 2012, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).