Xinyi Yeow

Design and fabrication of low-loss horizontal and vertical interconnect links using air-clad transmission lines and through silicon vias

R. Bashirullah, P. Kohl, R. Saha, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Electroless Deposition of Copper on Organic and Inorganic Substrates Using a Sn/Ag Catalyst

P. Kohl, Z. Wen, S. Allen, 2012 .