H. Kobayashi

Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias

M. Koyanagi, H. Nohira, T. Fukushima, 2010, 2010 International Electron Devices Meeting.

Minimizing the local deformation induced around Cu-TSVs and CuSn/InAu-microbumps in high-density 3D-LSIs

M. Koyanagi, T. Fukushima, T. Tanaka, 2012, 2012 International Electron Devices Meeting.

High density 3D LSI technology using W/Cu hybrid TSVs

M. Koyanagi, T. Fukushima, T. Tanaka, 2011, International Electron Devices Meeting.

Chip-based hetero-integration technology for high-performance 3D stacked image sensor

Kang Wook Lee, M. Koyanagi, T. Kamada, 2012, 2012 2nd IEEE CPMT Symposium Japan.

Locally induced stress in stacked ultrathin Si wafers: XPS and μ-Raman study

M. Koyanagi, H. Nohira, T. Fukushima, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.