W. Y. Hnin

Study of 15µm pitch solder microbumps for 3D IC integration

D. Kwong, S. W. Ho, V. Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.

Development of Stretch Solder Interconnections for Wafer Level Packaging

R. Tummala, M. Iyer, A. Tay, 2008, IEEE Transactions on Advanced Packaging.

Super stretched solder interconnects for wafer level packaging

R. Tummala, M. Iyer, A. Tay, 2006, 56th Electronic Components and Technology Conference 2006.

Design of a bidirectional WDM module for multi-channel transceivers

Jing Li, Teck Guan Lim, Jing Zhang, 2007, SPIE/OSA/IEEE Asia Communications and Photonics.

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

A. Kumar, D. Pinjala, J. H. Lau, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects

V. Kripesh, Seung Wook Yoon, A.G.K. Viswanath, 2008, IEEE Transactions on Advanced Packaging.

3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

John H. Lau, Nandar Su, Vaidyanathan Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.

Process Development and Reliability of Microbumps

Vempati Srinivasa Rao, Vaidyanathan Kripesh, Andy Fenner, 2010, IEEE Transactions on Components and Packaging Technologies.

Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect

Xiaowu Zhang, R. Murthy, W.H. Zhu, 2008, 2008 58th Electronic Components and Technology Conference.