Ming Ching Jong

Study of 15µm pitch solder microbumps for 3D IC integration

D. Kwong, S. W. Ho, V. Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

A. Kumar, D. Pinjala, J. H. Lau, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.