R. Rajoo
发表
C. Selvanayagam,
Xiaowu Zhang,
D. Pinjala,
2009,
2009 11th Electronics Packaging Technology Conference.
C. Selvanayagam,
Xiaowu Zhang,
D. Pinjala,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Y. Mai,
E. Wong,
R. Rajoo,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Ranjan Rajoo,
T. B. Lim,
E. Wong,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
D. Kwong,
V. Sundaram,
R. Tummala,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
D. Kwong,
V. Sundaram,
C. Selvanayagam,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
V. N. Sekhar,
V. S. Rao,
G. Sharma,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
R. Tummala,
M. Iyer,
A. Tay,
2008,
IEEE Transactions on Advanced Packaging.
R. Tummala,
M. Iyer,
A. Tay,
2006,
56th Electronic Components and Technology Conference 2006.
Ranjan Rajoo,
K. H. Lee,
K. Lee,
2002
.
E. Wong,
R. Rajoo,
T. Lim,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
E. Wong,
R. Rajoo,
T. Lim,
2005,
IEEE Transactions on Components and Packaging Technologies.
Xiaowu Zhang,
R. Rajoo,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
T. Kang,
H. Ji,
Yu Chen,
2011
.
C. Premachandran,
H. Ji,
Yu Chen,
2009,
2009 11th Electronics Packaging Technology Conference.
R. Tummala,
A. Saxena,
R. Rajoo,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
V. N. Sekhar,
Xiaowu Zhang,
S. W. Ho,
2010,
2010 12th Electronics Packaging Technology Conference.
E.H. Wong,
R. Rajoo,
C.T. Lim,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Ee-Hua Wong,
Ranjan Rajoo,
E. Wong,
2003,
Microelectron. Reliab..
Ranjan Rajoo,
K. H. Lee,
E. Wong,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
E.H. Wong,
R. Rajoo,
S.K.W. Seah,
2006,
56th Electronic Components and Technology Conference 2006.
R. Rajoo,
Xintong Zhu,
R. R. Nistala,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
J. Kloosterman,
E. Wong,
R. Rajoo,
2006,
2006 8th Electronics Packaging Technology Conference.
Khong Chee Houe,
Lim Ying Ying,
V. N. Sekhar,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
S. Yoon,
Xiaowu Zhang,
V. Kripesh,
2010,
IEEE Transactions on Advanced Packaging.
Willem D. van Driel,
N. Owens,
Ee-Hua Wong,
2008,
Microelectron. Reliab..
E. Wong,
R. Rajoo,
K. T. Tsai,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.