D. Chino

Au–Au Surface-Activated Bonding and Its Application to Optical Microsensors With 3-D Structure

T. Suga, R. Sawada, E. Higurashi, 2009, IEEE Journal of Selected Topics in Quantum Electronics.

Low-temperature bonding of photodiodes on glass substrate using Au stud bumps and its application to microsensors with three-dimensional structure

T. Suga, R. Sawada, E. Higurashi, 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.