N. Schneck

Accelerated Publication: Laser-assisted ultrathin die packaging: Insights from a process study

V. Marinov, O. Swenson, Y. Atanasov, 2013 .

Thermo-mechanical simulation of stacked chip scale packages with moire interferometry vaildation

A. Thoreson, N. Schneck, Z. Johnson, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

THERMO-MECHANICAL SIMULATION OF STACKED CHIP SCALE

A. Thoreson, N. Schneck, Z. Johnson, 2006 .

Laser-assisted ultrathin bare die packaging: a route to a new class of microelectronic devices

Val R. Marinov, Orven Swenson, Yuriy Atanasov, 2013, Photonics West - Lasers and Applications in Science and Engineering.