C. Wong

发表

Multistack flip chip 3D packaging with copper plated through-silicon vertical interconnection

S. Lee, R. Hon, S. Zhang, 2005, 2005 7th Electronic Packaging Technology Conference.

A multi-scale interfacial delamination model of Cu-SAM-epoxy systems

M. Yuen, H. Fan, C. Wong, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Silicon Integrated Photonics for Microelectronics Evolution

H. Wong, P. Chung, C. Wong, 2006, 2006 25th International Conference on Microelectronics.

A New Approach in Measuring Cu–EMC Adhesion Strength by AFM

M. Yuen, B. Xu, H. Gu, 2006, IEEE Transactions on Components and Packaging Technologies.

Kinetics Study of Disulfide Self Assembly Monolayer (SAM) Deposition for Cu-EMC Adhesion Promotion

M. Yuen, B. Xu, C. Wong, 2006, 2006 International Conference on Electronic Materials and Packaging.

Kinetic Study of Disulfide Molecular Film Deposition for Cu-EMC Adhesion Promotion

M. Yuen, B. Xu, C. Wong, 2006, 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.

Study of microscopic defects in silicon oxynitride films prepared by plasma-enhanced chemical vapor deposition process

C. Kok, C. Wong, W. Tam, 2008, 2008 IEEE International Conference on Electron Devices and Solid-State Circuits.

Photoluminescence of Silicon Nitride-Embedded Silicon Nanocrystallites Prepared by Thermal Annealing of Si-Rich Silicon Nitride

C. Kok, M. Chan, H. Wong, 2007, 2007 IEEE Conference on Electron Devices and Solid-State Circuits.

Properties of enhanced hydrostatic pressure-annealed silicon oxynitride films

C. Kok, C. Wong, A. Misiuk, 2008, 2008 IEEE International Conference on Electron Devices and Solid-State Circuits.

Preparation of Si nanocrystallites by phase separation of Si-rich silicon nitride

M. Chan, H. Wong, C. Wong, 2008, 2008 26th International Conference on Microelectronics.

Thiol based chemical treatment as adhesion promoter for Cu-epoxy interface

M. Yuen, C. Wong, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation

Haibo Fan, M. Yuen, H. Fan, 2008, IEEE Transactions on Components and Packaging Technologies.

A new method to predict delamination in electronic packages

M. Yuen, H. Fan, C. Wong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Fabrication of Optical Waveguide using Silicon Oxynitride Prepared by Thermal Oxidation of Silicon Rich Silicon Nitride

C. Kok, M. Chan, H. Wong, 2005, 2005 IEEE Conference on Electron Devices and Solid-State Circuits.

Reliability prediction in electronic packages using molecular simulation

M. Yuen, H. Fan, C. Wong, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling

S. Lee, R. Hon, S. Zhang, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Molecular simulation of cu-sam adhesion force

M. Yuen, H. Fan, C. Wong, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Investigation of adhesion properties of Cu-EMC interface by molecular dynamic simulation

M. Yuen, H. Fan, C. Wong, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

A new approach in measuring Cu-EMC adhesion strength by AFM [electronics packaging applications]

M. Yuen, B. Xu, H. Gu, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Interfacial strength assessment of Cu-epoxy system by atomic force microscope

M. Yuen, B. Xu, C. Wong, 2006, 56th Electronic Components and Technology Conference 2006.

Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip

Kai Zhang, P.C.H. Chan, P. Chan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Electroluminescence of silicon nanoclusters excited by tunneling carrier injection

Hei Wong, D. Nicolaescu, H. Wong, 2007, 2007 IEEE 20th International Vacuum Nanoelectronics Conference.