Hyo-Hoon Park

Optical backplane system using waveguide-embedded PCBs and optical slots

Young Un Heo, Keun-byoung Yoon, B. Rho, 2004 .

PCB-compatible optical interconnection using 45/spl deg/-ended connection rods and via-holed waveguides

B. Rho, Hyo-Hoon Park, Byoung-Ho Rhee, 2004 .

Board-to-board optical interconnection system using optical slots

In-Kui Cho, Seung Ho Ahn, Keun-Byoung Yoon, 2004 .

Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

Seong-Ook Park, Han Seo Cho, Kun-Mo Chu, 2006, IEEE Transactions on Advanced Packaging.

Chip-to-Chip Optical Link System Using an Optical Wiring Method

B. Rho, In-Kui Cho, S. Ahn, 2007, IEEE Photonics Technology Letters.

Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI

M. Jeong, J. Yun, In-Kui Cho, 2010, IEEE Transactions on Advanced Packaging.

A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

D. Jeon, Hyo-Hoon Park, H. Cho, 2004, IEEE Transactions on Electronics Packaging Manufacturing.

Characteristics of Indium Bump for Flip-Chip Bonding Used in Polymeric-Waveguide-Integrated Optical Interconnection Systems

D. Jeon, B. Rho, Hyo-Hoon Park, 2004 .

Improving 60-GHz band radio-frequency with radio-over-fiber link characteristics of optical transmitter system-on-packaging

Hyun-Kyu Yu, Yong-Duck Chung, Jong-Tae Moon, 2008 .

System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link

Hyun-Kyu Yu, Kwang-Seong Choi, Yong-Duck Chung, 2008, IEEE Transactions on Advanced Packaging.

Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist

D. Jeon, Hyo-Hoon Park, Kun-Mo Chu, 2004, 2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of.