M. Uomoto
发表
M. Ichikawa,
T. Kemmochi,
T. Mukai,
2019,
ECS Journal of Solid State Science and Technology.
M. Uomoto,
T. Shimatsu,
2010
.
M. Uomoto,
T. Shimatsu,
2010
.
H. Matsuzaki,
T. Hoshi,
M. Uomoto,
2019
.
Miyuki Uomoto,
M. Uomoto,
T. Shimatsu,
2014
.
M. Uomoto,
T. Shimatsu,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
M. Uomoto,
T. Shimatsu,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
M. Uomoto,
T. Shimatsu,
G. Yonezawa,
2019,
Japanese Journal of Applied Physics.
M. Uomoto,
T. Shimatsu,
M. Abe,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
M. Uomoto,
T. Shimatsu,
S. Matsuda,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
M. Uomoto,
T. Shimatsu,
Y. Suzuki,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
M. Uomoto,
T. Shimatsu,
G. Yonezawa,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
M. Uomoto,
T. Shimatsu,
Y. Suzuki,
2019,
Japanese Journal of Applied Physics.
M. Uomoto,
T. Shimatsu,
2019,
Japanese Journal of Applied Physics.
T. Suga,
Yoshikazu Takahashi,
E. Higurashi,
2019,
Applied Surface Science.
M. Uomoto,
T. Shimatsu,
S. Matsuda,
2019,
Japanese Journal of Applied Physics.
M. Uomoto,
T. Shimatsu,
M. Nada,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
M. Uomoto,
T. Shimatsu,
N. Nakajima,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Mukai,
T. Kemmochi,
M. Uomoto,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Hoshi,
M. Uomoto,
T. Shimatsu,
2018
.
K. Doh-ura,
M. Uomoto,
M. Iha,
2007,
Antimicrobial Agents and Chemotherapy.
T. Suga,
M. Uomoto,
T. Shimatsu,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Takashi Mukai,
Akira Fujioka,
Hiroto Tamaki,
2016
.
Shuji Tanaka,
M. Uomoto,
T. Shimatsu,
2018,
IUS.
M. Uomoto,
T. Shimatsu,
G. Yonezawa,
2018,
ECS Transactions.
M. Uomoto,
T. Shimatsu,
T. Shimatsu,
2012,
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.
M. Uomoto,
T. Shimatsu,
2016
.
H. Matsuzaki,
M. Uomoto,
T. Shimatsu,
2020,
physica status solidi (a).