A. Logan

Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-Based wafer bonding process

J. Yeow, A. Logan, 2009, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

A 1-D Capacitive Micromachined Ultrasonic Transducer Imaging Array Fabricated With a Silicon-Nitride-Based Fusion Process

A. S. Logan, J. Yeow, A. Logan, 2011, IEEE/ASME Transactions on Mechatronics.

A 32 x 32 element row-column addressed capacitive micromachined ultrasonic transducer

J. Yeow, A. Logan, L. Wong, 2011, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

1-D CMUT arrays fabricated using a novel wafer bonding process

J. Yeow, A. Logan, A.S. Logan, 2008, 2008 IEEE Ultrasonics Symposium.

The Design, Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers for Imaging Applications

A. Logan, Andrew Stephan Logan, 2010 .

A row-column addressed micromachined ultrasonic transducer array for surface scanning applications.

Zhenhao Li, Lawrence L P Wong, Andrew S Logan, 2014, Ultrasonics.

2-D CMUT wafer bonded imaging arrays with a row-column addressing scheme

John T. W. Yeow, J. Yeow, A. Logan, 2009, 2009 IEEE International Ultrasonics Symposium.