S. Ikeda

Single-wafer manufacturing technologies in 300-mm wafer fab

S. Ikeda, 2004, Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004..

Mechanical stress control in a VLSI-fabrication process: a method for obtaining the relation between stress levels and stress-induced failures

H. Miura, S. Ikeda, H. Ohta, 2003 .

The impact of mechanical stress control on VLSI fabrication process

H. Miura, S. Ikeda, H. Ohta, 1996, International Electron Devices Meeting. Technical Digest.

Mechanical Stress Simulation for Highly Reliable Deep-Submicron Devices

Hideo Miura, Shuji Ikeda, H. Miura, 1999 .

Stress Analysis of Transistor Structures Considering the Internal Stress of Thin Films

Hideo Miura, Hiroyuki Ohta, Naoto Saito, 1996 .

Process integration of single-wafer technology in a 300-mm fab, realizing drastic cycle time reduction with high yield and excellent reliability

Y. Sasaki, Michimasa Funabashi, K. Nemoto, 2003 .