A. Miller

发表

K. Rebibis, E. Beyne, I. De Wolf, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

K. Rebibis, S. Van Huylenbroeck, P. Verheyen, 2018, 2018 IEEE Symposium on VLSI Technology.

S. Van Huylenbroeck, P. Verheyen, D. Velenis, 2018, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

K. Rebibis, E. Beyne, B. Swinnen, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

B. Dutta, A. Mani, H. Osman, 2012, 2012 SEMI Advanced Semiconductor Manufacturing Conference.

K. Rebibis, D. Guermandi, S. Van Huylenbroeck, 2019, European Conference on Optical Communication.

J. De Coster, S. Balakrishnan, K. Croes, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

E. Beyne, A. Phommahaxay, K. Rebibis, 2018, 2018 International Wafer Level Packaging Conference (IWLPC).

F. Inoue, K. Rebibis, G. Beyer, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

E. Beyne, A. Jourdain, S. Suhard, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

E. Beyne, N. Collaert, D. Velenis, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

E. Beyne, M. Liebens, A. Miller, 2019, 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

A. Jourdain, G. Beyer, E. Beyne, 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.

F. Inoue, G. Beyer, E. Beyne, 2017, 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

F. Inoue, G. Beyer, E. Beyne, 2018, 2018 IEEE International Interconnect Technology Conference (IITC).

M. Gonzalez, E. Beyne, Mikael Detalle, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).