Q. Ma

发表

Size dependent hardness of silver single crystals

D. Clarke, Q. Ma, 1995 .

A four-point bending technique for studying subcritical crack growth in thin films and at interfaces

Q. Ma, Qing Ma, 1997 .

Measurement and Modeling of Intrinsic Stresses in CVD W Lines

P. Flinn, T. Marieb, Q. Ma, 1995 .

Diffusion along (001) tilt boundaries in the Au/Ag system--I. Experimental results

Q. Ma, R. Balluffi, 1993 .

Residual stresses in Al2O3ZrO2 composites: A test of stochastic stress models

D. Clarke, J. D. French, Q. Ma, 1994 .

Piezospectroscopic Determination of Residual Stresses in Polycrystalline Alumina

D. Clarke, Q. Ma, 1994 .

Stress Measurement in Single‐Crystal and Polycrystalline Ceramics Using Their Optical Fluorescence

David R. Clarke, D. Clarke, Q. Ma, 1993 .

Stress redistribution in ceramic/metal multilayers containing cracks

M. C. Shaw, A. Evans, D. Clarke, 1995 .

In-Situ Fluorescence Strain Sensing of the Stress in Interconnects

D. Clarke, Q. Ma, Q. Wen, 1994 .

Mechanics of the push-out process from in situ measurement of the stress distribution along embedded sapphire fibers

J. Hutchinson, D. Clarke, Lei Liang, 1994 .

Measurement of residual stresses in sapphire fiber composites using optical fluorescence

David R. Clarke, D. Clarke, Q. Ma, 1993 .

Optical fluorescence from chromium ions in sapphire: A probe of the image stress

D. Clarke, Q. Ma, 1993 .

Investigation of moisture-assisted fracture in SiO2 films using a channel cracking technique

K. McElhaney, Q. Ma, 2004 .

Measurement of Toughness for Sin Films on Silicon Using Channel Cracking Technique

Q. Ma, B. Sun, Q. Tran, 1999 .

Polymer/metal Interfaces in Interconnect Structures: Moisture Diffusion and Stress Corrosion Effects

Q. Ma, Q. Tran, H. Fujimoto, 1998 .

Channel Cracking Technique for Toughness Measurement of Brittle Dielectric Thin Films on Silicon Substrates

Q. Ma, J. Xie, R. S. Mcfadden, 1998 .

Adhesion Measurement of Interfaces in Multilayer Interconnect Structures

R. Dauskardt, M. Lane, Q. Ma, 1997 .

Measurement of the Fracture Energy of SiO 2 /TiN Interfaces Using the Residually-Stressed Thin-Film Micro-Strip Test

D. Clarke, M. He, D. Ragan, 1996 .

Adhesion and debonding of multi-layer thin film structures

Michael Lane, Reinhold H. Dauskardt, R. Dauskardt, 1998 .

Progressive Debonding of Multilayer Interconnect Structures

R. Dauskardt, M. Lane, Q. Ma, 1997 .

Thin Film Cracking and Ratcheting Caused by Temperature Cycling

Z. Suo, M. Huang, Q. Ma, 2000 .

Precipitate Drifting and Coarsening Caused by Interface Electromigration

Z. Suo, Q. Ma, 1994 .

Diffusion along [001] tilt boundaries in the Au/Ag system—II. atomistic modeling and interpretation

Robert W. Balluffi, James B. Adams, J. B. Adams, 1993 .

Random walk model for self-diffusivities and correlation factors in periodic grain boundaries

Q. Ma, R. Balluffi, 1994 .

Measurement of Thin Film Mechanical Properties by Microbeam Bending

Oliver Kraft, J. N. Florando, William D. Nix, 1999 .

A coupled model of stress, creep, and diffusion in the film/substrate system

Feng Xie, Weixu Zhang, Huimin Li, 2020 .

Developing design rules to avert cracking and debonding in integrated circuit structures

H. Fujimoto, Z. Suo, Q. Ma, 2000 .

Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures

Farhad Moghadam, Vivek Jain, Paul A. Flinn, 1995 .

Plastic ratcheting induced cracks in thin film structures

Z. Suo, Z. Suo, M. Huang, 2002 .

Split singularities: stress field near the edge of a silicon die on a polymer substrate

Z. Suo, Q. Ma, Xiao Hu Liu, 1998 .

Micromechanics-Based Modeling of Interfacial Debonding in Multilayer Structures

Huajian Gao, Q. Ma, P. Klein, 1999 .

Subcritical Debonding of Multilayer Interconnect Structures: Temperature and Humidity Effects

M. Lane, Nety M. Krishna, Q. Ma, 1999 .

Cracking and Debonding in Integrated Microstructures

Z. Suo, Q. Ma, H. Fujimoto, 1998 .