J. J. Wei

发表

Enhanced Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron-Scale Roughness

H. Honda, H. Takamastu, J. J. Wei, 2002 .

Enhanced boiling heat transfer from electronic components by use of surface microstructures

H. Honda, J. J. Wei, 2004 .

Effects of Fin Geometry on Boiling Heat Transfer from Silicon Chips with Micro-Pin-Fins Immersed in FC-72

H. Honda, J. J. Wei, 2003 .

Advances in enhanced boiling heat transfer from electronic components

H. Honda, Jinjia Wei, H. Honda, 2003 .

SIMULTANEOUS NATURAL-CONVECTION HEAT TRANSFER ABOVE AND BELOW AN ISOTHERMAL HORIZONTAL THIN PLATE

Y. Kawaguchi, J. J. Wei, Y. Kawaguchi, 2003 .

Formulized average surface binding energy elevation and lithium vaporization and redeposition investigations in capillary pore systems

D. Zhang, J. J. Wei, F. Gou, 2019, Nuclear Fusion.

Structural damage detection including the temperature difference based on response sensitivity analysis

J. J. Wei, Z. Lv, 2015 .

Effects of coating pressure on the thermal and mechanical properties of glow discharge polymer films

Liangchi Zhang, J. Yan, J. J. Wei, 2011 .

Experimental study of boiling phenomena and heat transfer performances of FC-72 over micro-pin-finned silicon chips

Jinjia Wei, Liejin Guo, H. Honda, 2005 .

Reduction and turbulence characteristics in sub-zero temperature range of cationic and zwitterionic surfactants in EG/water solvent

J. L. Zakin, Bo Yu, Jinjia Wei, 2009 .

Shock induced reaction of Ni/Al nanopowder mixture.

C. Meng, J. J. Wei, Q. Y. Chen, 2012, Journal of nanoscience and nanotechnology.

Turbulent Drag Reduction with Surfactant Additives — Basic Research and Application to an Air Conditioning System

F. C. Li, J. J. Wei, Y. Kawaguchi, 2007 .

Performance of a new dry lubricant in the forming of aluminum alloy sheets

Kamineni Pitcheswara Rao, K. P. Rao, J. J. Wei, 2001 .