Jaesung Lee

发表

Jaesung Lee, P. Feng, Zenghui Wang, 2014, 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).

Jaesung Lee, P. Feng, Zenghui Wang, 2013, 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC).

Jaesung Lee, P. Feng, 2014, 2014 IEEE International Frequency Control Symposium (FCS).

S. Mandal, Tengda Mei, Jaesung Lee, 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS).

D. Young, Jaesung Lee, P. Feng, 2014, 2014 IEEE International Frequency Control Symposium (FCS).

Jaesung Lee, Xu-Qian Zheng, P. Feng, 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS).

A. Bachtold, A. Eichler, Jaesung Lee, 2022, ACS nano.

Jaesung Lee, P. Feng, 2012, 2012 IEEE International Frequency Control Symposium Proceedings.

A. Bachtold, A. Eichler, Jaesung Lee, 2022, ACS nano.

Jaesung Lee, P. Feng, Arnob Islam, 2017, 2017 75th Annual Device Research Conference (DRC).

Huaizhong Li, M. Rais-Zadeh, D. Dao, 2022, Sensors and Actuators A: Physical.

Philip X.-L. Feng, Xu-Qian Zheng, Jaesung Lee, 2017, Microsystems & Nanoengineering.

Jaesung Lee, P. Feng, A. Kaul, 2014 .

J. Shan, Jaesung Lee, P. Feng, 2013, ACS nano.

Jaesung Lee, P. Feng, Yong Xie, 2020, Advanced Materials Technologies.

Jaesung Lee, Xu-Qian Zheng, P. Feng, 2019, ACS Photonics.

Jaesung Lee, P. Feng, Arnob Islam, 2020, 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).

Zenghui Wang, Philip X.-L. Feng, Jaesung Lee, 2014, Scientific Reports.

W. Du, G. Ye, V. Pashaei, 2018, ACS applied materials & interfaces.

Jaesung Lee, P. Feng, A. Kaul, 2017, Nanoscale.

D. Czaplewski, Changyao Chen, Jaesung Lee, 2017, 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).

Fan Ye, Jaesung Lee, P. Feng, 2017, 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).

Jaesung Lee, M. LaHaye, P. Feng, 2022, Applied Physics Letters.

C. Liu, Jaesung Lee, P. Feng, 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

M. Roukes, M. Matheny, Jaesung Lee, 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS).

C. Zorman, Lu Han, Hongping Zhao, 2018, IEEE Electron Device Letters.

Stewart Sherrit, Mina Rais-Zadeh, Philip X.-L. Feng, 2019, Journal of Microelectromechanical Systems.

M. Rais-Zadeh, Jaesung Lee, P. Feng, 2017, IEEE/LEOS International Conference on Optical MEMS.

Jaesung Lee, P. Feng, 2021, Applied Physics Letters.

peixiong zhao, R. Reed, M. Mccurdy, 2023, IEEE Transactions on Nuclear Science.

S. Shaw, Jaesung Lee, P. Feng, 2023, 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS).

Jaesung Lee, P. Feng, H. Jia, 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII).

J. Shan, Jaesung Lee, P. Feng, 2013 .

Jaesung Lee, P. Feng, Xu-Qian Zheng, 2015, 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS).

D. Young, Jaesung Lee, P. Feng, 2014, 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).

C. Zorman, Lu Han, Hongping Zhao, 2017, ACS applied materials & interfaces.

Soumyajit Mandal, Philip X.-L. Feng, Christian A. Zorman, 2019, IEEE Transactions on Circuits and Systems I: Regular Papers.

Jaesung Lee, P. Feng, Zenghui Wang, 2013, 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFC).

Jaesung Lee, P. Feng, A. Kaul, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Jaesung Lee, P. Feng, Yanan Wang, 2024, Applied Physics Letters.

Huikai Xie, Jaesung Lee, P. Feng, 2024, IEEE Sensors Journal.

C. Zorman, Lu Han, Hongping Zhao, 2018, Journal of Electronic Materials.