J. Ruhkopf

发表

A. D. Smith, M. Ostling, M. Lemme, 2014, 2103.14880.

Martin R. Lohe, Xinliang Feng, M. Lemme, 2022, 2204.04509.

Max C. Lemme, Henri Happy, Amit Gahoi, 2016, 2016 46th European Solid-State Device Research Conference (ESSDERC).

U. Schnakenberg, M. Nagel, M. Lemme, 2019, ACS applied electronic materials.

M. Lemme, H. Przewlocki, V. Passi, 2017, 2017 International Conference of Microelectronic Test Structures (ICMTS).