T. Waber

Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package

T. Waber, M. Sax, W. Pahl, 2014 .

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

Wolfgang Pahl, Anton Leidl, G. Feiertag, 2014 .

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

T. Waber, W. Pahl, S. Stufler, 2014, Microsystem Technologies.