G. Feiertag

Fabrication and characterization of a piezoresistive humidity sensor with a stress-free package

T. Waber, M. Sax, W. Pahl, 2014 .

Calculation and experimental determination of the structure transfer accuracy in deep x-ray lithography

W. Ehrfeld, Andreas Schmidt, G. Feiertag, 1997 .

A systematic MEMS sensor calibration framework

G. Feiertag, A. Dickow, 2015 .

Fabrication of photonic crystals by deep x-ray lithography

Wolfgang Ehrfeld, Heinz Lehr, Costas M. Soukoulis, 1997 .

Application of an Angular Exposure System to fabricate true-chip-size packages for SAW devices

Christian Bauer, Gregor Feiertag, Dietrich Tonnies, 2011, 18th European Microelectronics & Packaging Conference.

Recent advances in SAW packaging

P. Selmeier, G. Feiertag, A. Przadka, 2001, 2001 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.01CH37263).

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

Wolfgang Pahl, Anton Leidl, G. Feiertag, 2014 .

Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

T. Waber, W. Pahl, S. Stufler, 2014, Microsystem Technologies.

Fabrication of Three-Dimensional Photonic Band Gap Material by Deep X-Ray Lithography

Wolfgang Ehrfeld, Heinz Lehr, Costas M. Soukoulis, 1996 .

BLACK-BOX IDENTIFICATION OF A THERMOELECTRIC TEMPERATURE CONTROL SYSTEM FOR PIEZORESISTIVE PRESSURE SENSOR-CALIBRATION

Andreas Dickow, Klemens Graf, G. Feiertag, 2013 .

MEMS microphones with narrow sensitivity distribution

Anton Leidl, G. Feiertag, Christian Siegel, 2016 .