M. Pustan

发表

Z. Rymuza, M. Pustan, G. Ekwiński, 2007 .

M. Pustan, A. Baracu, R. Muller, 2018, 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP).

M. Pustan, C. Bîrleanu, C. Dudescu, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

M. Pustan, A. Baracu, R. Muller, 2017, 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

R. Voicu, M. Pustan, A. Baracu, 2015, 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

A. Dinescu, C. Tibeica, R. Voicu, 2016, 2016 International Semiconductor Conference (CAS).

R. Voicu, M. Pustan, C. Bîrleanu, 2020, 2020 International Semiconductor Conference (CAS).

M. Pustan, C. Bîrleanu, H. Crișan, 2022, International journal of environmental research and public health.

M. Pustan, C. Bîrleanu, C. Popa, 2018, Proceedings of the 4th International Congress of Automotive and Transport Engineering (AMMA 2018).

M. Pustan, C. Bîrleanu, 2014, 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

M. Pustan, F. Rusu, A. Baracu, 2018, Microsystem Technologies.

M. Pustan, C. Bîrleanu, H. Banciu, 2021, Proceedings of Micromachines 2021 — 1st International Conference on Micromachines and Applications (ICMA2021).

C. Cosma, M. Pustan, C. Bîrleanu, 2020, IOP Conference Series: Materials Science and Engineering.

M. Pustan, C. Bîrleanu, 2015, Analog Integrated Circuits and Signal Processing.

M. Pustan, F. Rusu, A. Baracu, 2017, 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

O. Tutunaru, R. Voicu, M. Pustan, 2020, IOP Conference Series: Materials Science and Engineering.

M. Pustan, C. Bîrleanu, N. Burnete, 2018, Proceedings of the 4th International Congress of Automotive and Transport Engineering (AMMA 2018).

M. Pustan, C. Bîrleanu, H. Crișan, 2021, International journal of environmental research and public health.

M. Pustan, C. Bîrleanu, C. Dudescu, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

M. Pustan, C. Bîrleanu, V. Merie, 2021, Micromachines.

J. Golinval, V. Rochus, M. Pustan, 2012, Microsystem Technologies.

M. Pustan, C. Bîrleanu, C. Dudescu, 2013, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Jean-Claude Golinval, M. Pustan, V. Rochus, 2011, Journal of Microelectromechanical Systems.

R. Voicu, M. Pustan, R. Muller, 2011, Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).

M. Pustan, C. Bîrleanu, V. Merie, 2019, IOP Conference Series: Materials Science and Engineering.

M. Pustan, C. Bîrleanu, C. Dudescu, 2015, Microsystem Technologies.

M. Pustan, C. Bîrleanu, V. Merie, 2019, IOP Conference Series: Materials Science and Engineering.

M. Pustan, C. Dudescu, C. Birleanu, 2016, 2016 International Semiconductor Conference (CAS).

M. Pustan, C. Bîrleanu, C. Dudescu, 2012, 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.

J. Golinval, M. Pustan, C. Bîrleanu, 2014 .

M. Pustan, C. Bîrleanu, H. Crișan, 2020, IOP Conference Series: Materials Science and Engineering.

M. Pustan, C. Bîrleanu, V. Merie, 2018, Powder Metallurgy and Advanced Materials.

C. Tibeica, R. Voicu, M. Pustan, 2024, 2024 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS).

D. Marconi, M. Pustan, L. Zârbo, 2020, IOP Conference Series: Materials Science and Engineering.