T. Licht

发表

AlSiC composite materials in IGBT power modules

H. Degischer, G. Mitic, G. Lefranc, 2000, Conference Record of the 2000 IEEE Industry Applications Conference. Thirty-Fifth IAS Annual Meeting and World Conference on Industrial Applications of Electrical Energy (Cat. No.00CH37129).

Power cycling induced failure mechanisms in solder layers

J. Lutz, T. Licht, T. Herrmann, 2007, 2007 European Conference on Power Electronics and Applications.

Power cycling induced failure mechanisms in the viewpoint of rough temperature environment

J. Lutz, T. Licht, M. Feller, 2008 .

IGBT module technology with high partial discharge resistance

G. Mitic, G. Lefranc, T. Licht, 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).

Structural and electrical investigation of implantation damage annealing in CdTe

U. Reislöhner, W. Witthuhn, J. Bollmann, 1996 .

TLPB Improves Solder Connections by On Chip Creation of Intermetallic Phase Precursors

T. Licht, Anna Steenmann, Jessica Richter, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Reliable power electronics for automotive applications

Guy Lefranc, Norbert Seliger, E. Wolfgang, 2002, Microelectron. Reliab..

Damage production in GaAs during MeV ion implantation

F. Komarov, U. Reislöhner, P. Gaiduk, 1996 .

Recoil implantation of radioactive transition metals and their investigation in silicon by deep‐level transient spectroscopy

U. Reislöhner, W. Witthuhn, H. Gottschalk, 1995 .

Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics

Golta Khatibi, Brigitte Weiss, Herbert Danninger, 2010 .