W. Muller
发表
H. Reichl,
T. Eckert,
W. Muller,
2009,
2009 59th Electronic Components and Technology Conference.
H. Reichl,
T. Eckert,
W. Muller,
2009,
2009 11th Electronics Packaging Technology Conference.
W. Muller,
H. Albrecht,
J. Jendrny,
1997
.
Coarsening processes in the lead-free solder alloy AgCu: theoretical and experimental investigations
W. Muller,
T. Bohme,
2005,
2005 7th Electronic Packaging Technology Conference.
W. Muller,
H. Albrecht,
T. Hannach,
2006,
2006 1st Electronic Systemintegration Technology Conference.
W. Muller,
H. Worrack,
Mohamad Sbeiti,
2010,
2010 12th Electronics Packaging Technology Conference.
B. Abali,
W. Muller,
P. Lofink,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
W. Muller,
C. Bohm,
T. Hauck,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
H. Reichl,
W. Muller,
N. Nissen,
2010,
3rd Electronics System Integration Technology Conference ESTC.
W. Muller,
T. Bohme,
Wolfgang H. Müller,
2006,
2006 8th Electronics Packaging Technology Conference.
H. Reichl,
J. Kleff,
W. Muller,
2009,
2009 11th Electronics Packaging Technology Conference.
W. Muller,
2002
.
B. Michel,
J. Auersperg,
B. Michel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
T. Hauck,
C. Bohm,
W. Muller,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
A. Middendorf,
A. Grams,
O. Wittler,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Reuben,
D. S. Brodie,
W. Muller,
2002,
4th Electronics Packaging Technology Conference, 2002..