T. Hauck
发表
J. Korvink,
L. Feng,
E.B. Rudnyiz,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
T. Hauck,
A. Augustin,
Schatzbogen,
2006
.
T. Hauck,
J. Bagdahn,
M. Ebert,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
J. Mehner,
T. Hauck,
I. Schmadlak,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
L. L. Mercado,
T. Hauck,
H. Wieser,
2003
.
L. Mercado,
T. Hauck,
H. Wieser,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
L. Mercado,
T. Hauck,
V. Sarihan,
2000,
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).
W. Muller,
C. Bohm,
T. Hauck,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
K. P. Herrmann,
Torsten Hauck,
M. Dong,
1997
.
L. L. Mercado,
V. Sarihan,
T. Hauck,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Herbert Reichl,
Bernd Michel,
Rainer Dudek,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
A. Augustin,
T. Hauck,
T. Hauck,
2007,
Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium.
Jan G. Korvink,
A. Augustin,
B. Maj,
2006
.
T. Hauck,
C. Bohm,
J. Korvink,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
T. Hauck,
I. Schmadlak,
G. Li,
2009,
TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
E. Rudnyi,
Leon Voss,
T. Hauck,
2009
.
T. Hauck,
W.H. Mueller,
I. Schmadlak,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
S. Orain,
W.D. van Driel,
T. Hauck,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
T. Hauck,
C. Bohm,
W. Muller,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
W. Müller,
A. Freidin,
A. Semencha,
2020,
Journal of Electronic Materials.
W. Müller,
A. Freidin,
T. Hauck,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Torsten Hauck,
Wim Teulings,
Evgenii Rudnyi,
2009,
2009 15th International Workshop on Thermal Investigations of ICs and Systems.
Torsten Hauck,
Vibhash Jha,
T. Hauck,
2015
.
T. Hauck,
B. Carpenter,
Amirul Afripin,
2021,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
S. Shantaram,
T. Hauck,
2014
.
T. Hauck,
Amirul Afripin,
2022,
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
K. P. Herrmann,
T. Hauck,
T. Hauck,
1997
.
T. Hauck,
K. Herrmann,
1997
.
Ilko Schmadlak,
Torsten Hauck,
Wolfgang H. Müller,
2010
.