B. Chao

Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints

J. Im, P. Ho, Xuefeng Zhang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .

Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders

P. Ho, Xuefeng Zhang, Seung-Hyun Chae, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Mechanistic Study of CO2 Plasma Damage to OSG Low k Dielectrics

P. Ho, M. Armacost, B. Chao, 2008, 2008 International Interconnect Technology Conference.

Effect of contact metallization on electromigration reliability of Pb-free solder joints

Peng Su, Paul S. Ho, Min Ding, 2006 .

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Xuefeng Zhang, Paul S. Ho, Brook Huang-Lin Chao, 2009, Microelectron. Reliab..

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Paul S. Ho, Min Ding, Seung-Hyun Chae, 2006 .

Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials

K. Lu, J. Im, P. Ho, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

A study of electromigration failure in Pb-free solder joints

Peng Su, Min Ding, P. Ho, 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..