S. Wiese
发表
H. Walter,
A. Schubert,
B. Michel,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
S. Wiese,
J. Al Ahmar,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions
B. Michel,
R. Dudek,
W. Faust,
2007,
2007 9th Electronics Packaging Technology Conference.
S. Jakschik,
S. Wiese,
F. Feustel,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
S. Rzepka,
K. Wolter,
M. Roellig,
2006,
2006 1st Electronic Systemintegration Technology Conference.
Klaus-Jurgen Wolter,
Steffen Wiese,
E. Meusel,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
K. Wolter,
M. Roellig,
S. Wiese,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
K. Wolter,
M. Roellig,
M. Petzold,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
S. Wiese,
F. Kraemer,
P. Ritter,
2012,
2012 4th Electronic System-Integration Technology Conference.
S. Rzepka,
K. Wolter,
S. Wiese,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
S. Wiese,
F. Kraemer,
P. Ritter,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Wolter,
S. Wiese,
Maik Mueller,
2009,
2009 59th Electronic Components and Technology Conference.
K. Wolter,
S. Wiese,
M. Mueller,
2008,
2008 2nd Electronics System-Integration Technology Conference.
K. Wolter,
S. Wiese,
M. Muller,
2006,
2006 1st Electronic Systemintegration Technology Conference.
S. Wiese,
F. Krämer,
R. Meier,
2009
.
Jens Lienig,
Sven Rzepka,
Steffen Wiese,
2010,
3rd Electronics System Integration Technology Conference ESTC.
S. Wiese,
F. Kraemer,
K. Meier,
2012,
2012 4th Electronic System-Integration Technology Conference.
S. Wiese,
K.-J. Wolter,
M. Rollig,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
K. Wolter,
M. Roellig,
S. Wiese,
2007
.
U. Eitner,
S. Wiese,
L. C. Rendler,
2018
.
S. Wiese,
R. Ratchev,
Y. Maniar,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Roellig,
S. Wiese,
J. Al Ahmar,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
R. Dyczij-Edlinger,
S. Wiese,
O. Farle,
2012,
2012 4th Electronic System-Integration Technology Conference.
S. Wiese,
J. Müller,
A. Schulz,
2022,
Microsystem Technologies.
S. Wiese,
A. Yuile,
2020,
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes
Jens Müller,
S. Wiese,
A. Schulz,
2022,
Applied Sciences.
K. Wolter,
S. Wiese,
I. Panchenko,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
K. Wolter,
S. Wiese,
I. Panchenko,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
S. Wiese,
A. Yuile,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
F. Kraemer,
D. Bruch,
2015,
European Microelectronics and Packaging Conference.
S. Wiese,
F. Kraemer,
S. Wiese,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Wiese,
F. Kraemer,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
Steffen Wiese,
E. Meusel,
F. Feustel,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
T. Welker,
J. Muller,
S. Wiese,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
K. Wolter,
S. Wiese,
M. Mueller,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Wiese,
K.-J. Wolter,
M. Roellig,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Steffen Wiese,
Klaus-Jürgen Wolter,
K. Wolter,
2004,
Microelectron. Reliab..
Steffen Wiese,
Klaus-Jürgen Wolter,
K. Wolter,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
K. Wolter,
M. Roellig,
S. Wiese,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
K. Wolter,
M. Roellig,
S. Wiese,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
Sven Rzepka,
Steffen Wiese,
S. Rzepka,
2004,
Microelectron. Reliab..
S. Rzepka,
Steffen Wiese,
E. Meusel,
1999,
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
S. Wiese,
A. Yuile,
2019,
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
S. Wiese,
E. Meusel,
S. Wiese,
2003
.
S. Wiese,
F. Feustel,
E. Meusel,
2000
.
S. Wiese,
K.-J. Wolter,
R. Metasch,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
K. Wolter,
M. Krause,
M. Petzold,
2008,
2008 58th Electronic Components and Technology Conference.
S. Wiese,
K.-J. Wolter,
M. Roellig,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
Mike Roellig,
Steffen Wiese,
Klaus-Jürgen Wolter,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
K. Wolter,
M. Krause,
M. Petzold,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
S. Rzepka,
Steffen Wiese,
E. Meusel,
1998
.
K. Wolter,
S. Wiese,
I. Panchenko,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Steffen Wiese,
E. Meusel,
F. Feustel,
2002
.
K. Wolter,
A. Graff,
M. Krause,
2006,
2006 1st Electronic Systemintegration Technology Conference.
S. Wiese,
K.-J. Wolter,
K. Meier,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
S. Wiese,
K.-J. Wolter,
K. Meier,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
S. Wiese,
E. Wiss,
D. Barth,
2021,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
S. Wiese,
J. Al Ahmar,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
J. Al Ahmar,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
U. Eitner,
S. Wiese,
A. Kraft,
2016
.
U. Eitner,
S. Wiese,
A. Kraft,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
F. Kraemer,
M. Roellig,
2018,
Microelectron. Reliab..
S. Wiese,
J. Al Ahmar,
F. Kraemer,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
F. Kraemer,
J. Ahmar,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Steffen Wiese,
S. Wiese,
J. Al Ahmar,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
S. Wiese,
J. Al Ahmar,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
J. Al Ahmar,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
Maik Mueller,
S. Schindler,
2014,
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).
S. Wiese,
K.-J. Wolter,
F. Kraemer,
2010,
2010 35th IEEE Photovoltaic Specialists Conference.
Steffen Wiese,
Rico Meier,
Frank Kraemer,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
U. Eitner,
S. Wiese,
A. Kraft,
2019,
Solar Energy Materials and Solar Cells.
S. Wiese,
P. Zerrer,
F. Kraemer,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
K. Wolter,
S. Wiese,
I. Panchenko,
2022,
Thermochimica Acta.
S. Wiese,
A. Yuile,
2016,
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
H. Wohlrabe,
A. Yuile,
2015,
2015 European Microelectronics Packaging Conference (EMPC).
S. Wiese,
A. Yuile,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Steffen Wiese,
Frank Kraemer,
S. Wiese,
2015,
Microelectron. Reliab..
S. Wiese,
S. Schindler,
2010,
3rd Electronics System Integration Technology Conference ESTC.
S. Wiese,
F. Kraemer,
S. Wiese,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
S. Schindler,
2011,
18th European Microelectronics & Packaging Conference.
S. Wiese,
R. Doring,
S. Rzepka,
2006,
2006 1st Electronic Systemintegration Technology Conference.
S. Wiese,
Y. Maniar,
J. Gleichauf,
2022,
Microelectronics Reliability.
S. Wiese,
Y. Maniar,
J. Gleichauf,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
J. Al Ahmar,
E. Wiss,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Wolter,
M. Roellig,
S. Wiese,
2010
.
S. Wiese,
K.-J. Wolter,
K. Meier,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
K.-J. Wolter,
K. Meier,
2010,
2010 12th Electronics Packaging Technology Conference.
K. Wolter,
M. Roellig,
S. Wiese,
2009,
2009 59th Electronic Components and Technology Conference.
K. Wolter,
M. Roellig,
S. Wiese,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.