Chris Chang
发表
J. Lau,
S. Pan,
Chris Chang,
2000,
Packaging of Electronic and Photonic Devices.
J. Lau,
Chih Chen,
Chris Chang,
1999
.
A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
John H. Lau,
Chris Chang,
Stephen H. Pan,
2000,
Packaging of Electronic and Photonic Devices.
J. Lau,
S. Pan,
Chris Chang,
2000,
Packaging of Electronic and Photonic Devices.
J. Lau,
Chris Chang,
1999
.
J. Lau,
Chris Chang,
D. Lin,
2000
.
John H. Lau,
Tony Chen,
David Cheng,
1998
.
J. Lau,
Chris Chang,
Tony Chen,
1999
.
Thomas Rendall,
Erik M. Bollt,
Pier Marzocca,
2006
.
John H. Lau,
Chris Chang,
J. Lau,
2000
.
J. H. Lau,
Chris Chang,
S. W. Ricky Lee,
2000
.