I. Menis

Design for lead‐free solder joint reliability of high‐density packages

J. Lau, D. Shangguan, W. Dauksher, 2004 .

Failure analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Walter Dauksher, 2004 .

Reliability testing and data analysis of an 1657CCGA (ceramic column grid array) package with lead-free solder paste on lead-free PCBs (printed circuit boards)

D. Shangguan, W. Dauksher, D. Love, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John H. Lau, Dongkai Shangguan, Walter Dauksher, 2004 .