Stefan Bengtsson

发表

Simulation-based management (SBM): various examples

Stefan Bengtsson, 2018, WSC 2018.

Planar double-gate SOI MOS devices: Fabrication by wafer bonding over pre-patterned cavities and electrical characterization

Denis Flandre, Benoit Olbrechts, Stefan Bengtsson, 2007 .

Modelling of Self Heating Effects of High Power Novel Vertical DMOS Transistors

Stefan Bengtsson, Jörgen Olsson, Kuntjoro Pinardi, 2001 .

Unclamped inductive switching behaviour of high power SOI vertical DMOS transistors with lateral drain contacts

Jean-Pierre Colinge, Stefan Bengtsson, Jörgen Olsson, 2002 .

Self Heating Effects of High Power DMOS Transistors

Stefan Bengtsson, Jörgen Olsson, Kuntjoro Pinardi, 2001 .

Care ethics to develop computing and engineering education for sustainability

Anne-Kathrin Peters, Mats Daniels, Stefan Bengtsson, 2020, 2020 IEEE Frontiers in Education Conference (FIE).

Proceedings of the 1997 10th Biennial Conference on Insulating Films on Semiconductor (INFOS)

Olof Engström, Stefan Bengtsson, 1997 .

Wafer bonding for MEMS

Peter Enoksson, Stefan Bengtsson, Alexandra Nafari, 2005 .

Can molecular resonant tunneling diodes be used for local refresh of DRAM memory cells

Stefan Bengtsson, Per Lundgren, Jonas Berg, 2000 .

Electrothermal simulations of high-power SOI vertical DMOS transistors with lateral drain contacts under unclamped inductive switching test

Jean-Pierre Colinge, Stefan Bengtsson, Jörgen Olsson, 2004 .

Steady-state and transient current transport in undoped polycrystalline diamond films

Olof Engström, Stefan Bengtsson, Anders Jauhiainen, 1997 .

Modification of silicon surfaces with H2SO4:H2O2:HF and HNO3:HF for wafer bonding applications

Stefan Bengtsson, Ulf Jansson, Anders Söderbärg, 1994 .

Wafer bonding using oxygen plasma treatment in RIE and ICP RIE

Stefan Bengtsson, Anke Sanz-Velasco, Petra Amirfeiz, 2001 .

Formation of Silicon Structures by Plasma‐Activated Wafer Bonding

Stefan Bengtsson, S. Bengtsson, L. Börjesson, 2000 .

Room Temperature Wafer Bonding Using Oxygen Plasma Treatment in Reactive Ion Etchers With and Without Inductively Coupled Plasma

Stefan Bengtsson, Anke Sanz-Velasco, S. Bengtsson, 2003 .

Low‐Temperature Preparation of Silicon/Silicon Interfaces by the Silicon‐to‐Silicon Direct Bonding Method

Olof Engström, Stefan Bengtsson, 1990 .

Plasma assisted room temperature bonding for MST

Stefan Bengtsson, S. Bengtsson, Petra Amirfeiz, 2001 .

Electrical Characterization of Bonding Interfaces

Olof Engström, Stefan Bengtsson, Gert Andersson, 1992 .

HfO2 gate dielectrics on strained-Si and strained-SiGe layers

Mikael Johansson, Stefan Bengtsson, Per Lundgren, 2003 .

Semiconductor Wafer Bonding: Science Technology, and Applications VI

Stefan Bengtsson, Helmut Baumgart, Charles E. Hunt, 2001 .

Properties of Al2O3-films deposited on silicon by atomic layer epitaxy

Stefan Bengtsson, Per Ericsson, S. Bengtsson, 1997 .