R. Bauer

New design of an SnO2 gas sensor on low temperature cofiring ceramics

L. Golonka, J. Kita, H. Teterycz, 1998 .

Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance

R. Durairaj, Nduka Nnamdi (Ndy) Ekere, S. Mallik, 2009, 2009 11th Electronics Packaging Technology Conference.

Applicability of Different Bio-based Polymers for Wiring Boards

A. Schmid, R. Bauer, C. Henning, 2019, Period. Polytech. Electr. Eng. Comput. Sci..

Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Nduka Nnamdi (Ndy) Ekere, S. Mallik, M. Schmidt, 2010 .