Peng Zhong

CMOS Compatible TSV Process with Post-CMOS Thermomigration Refilling of Au-Si Eutectic Alloy

Peng Zhong, B. Pei, Tingting Yu, 2020, 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).

A Novel Vacuum Packaging Process Using Sputtered Copper Layer as Non-Evaporable Getter Activated by Microwave

Peng Zhong, B. Pei, Heng Yang, 2020, 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).

Integrated Piezoresistive Normal Force Sensors Fabricated Using Transfer Processes with Stiction Effect Temporary Handling

Peng Zhong, Ke Sun, Ni Liu, 2022, Micromachines.

Oven-Controlled MEMS Oscillator with Integrated Micro-Evaporation Trimming

Xinxin Li, Binbin Pei, Ke Sun, 2020, Sensors.

Micro-Oven-Controlled MEMS Oscillator Integrated with Micro-Evaporator for Frequency Trimming

Peng Zhong, Tingting Yu, Heng Yang, 2020, 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).

Uniformly heated oven-controlled N++ [100] length-extensional-mode silicon resonator with ±500-ppb frequency error over industrial temperature range

Binbin Pei, Ke Sun, Xinxin Li, 2018, Sensors and Actuators A: Physical.