C. Dou

CMOS Compatible TSV Process with Post-CMOS Thermomigration Refilling of Au-Si Eutectic Alloy

Peng Zhong, B. Pei, Tingting Yu, 2020, 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).

Transferring stress and temperature sensors for stress measurement of wafer level packaging

C. Dou, Heng Yang, Xinxin Li, 2017 .

Stress monitoring in flip chip packaging process

C. Dou, Heng Yang, Fei Xiao, 2012 .

Self-assembly and transferring of photoresist as planar layer for fabrication of TSV and free standing beams

C. Dou, X. Li, H. Yang, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

Transferring stress and temperature sensors for stress measurement of wafer level packaging

C. Dou, Heng Yang, Xinxin Li, 2016, Microsystem Technologies.

Design, fabrication of through silicon vias based on suspended photoresist thin film and its application in silicon interposer

C. Dou, Heng Yang, Yanhong Wu, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Suspended Photoresist Thin Film for Fabrication of Through Silicon Vias

C. Dou, Heng Yang, Z. Wu, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.