J. Shih

Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding

Kuan-Neng Chen, C. Chiu, J. Shih, 2014, Nanoscale Research Letters.

Review Article: Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies

Kuan-Neng Chen, Shih-Wei Li, Ming-Fang Lai, 2011 .

Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications

Keng C. Chou, Kuan-Neng Chen, Cheng-Ta Ko, 2014, IEEE Transactions on Device and Materials Reliability.

Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance Modification

Kuan-Neng Chen, C. Chiu, J. Shih, 2015, IEEE Transactions on Electron Devices.

Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface

Kuan-Neng Chen, J. Shih, J. Leu, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.