H. Rempp

Ultra-thin chips and related applications, a new paradigm in silicon technology

J. Burghartz, C. Harendt, W. Appel, 2009, ESSDERC 2009.

A New Fabrication and Assembly Process for Ultrathin Chips

W. Appel, M. Zimmermann, J. Burghartz, 2009, IEEE Transactions on Electron Devices.

Thermal characterization and modeling of ultra-thin silicon chips

Joachim N. Burghartz, Zili Yu, Christine Harendt, 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).