Pen-Shan Chao

Development of CMOS Process Compatible Force Sensor and its Application to Probe Card

Jung-Tang Huang, Kuo-Yu Lee, Hou-Jun Hsu, 2007, 2007 IEEE Conference on Electron Devices and Solid-State Circuits.

An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip

Jung-Tang Huang, Kuo-Yu Lee, Hou-Jun Hsu, 2014 .

Singular Uniformity after Reflow of Varied-Shaped Flip Chip Solder Bump on Single Substrate

Jung-Tang Huang, Sheng-Hsiung Shih, Chan-Shoue Wu, 2006, 2006 International Conference on Electronic Materials and Packaging.

A novel polishing mechanism used in manufacturing ultra-high uniformity gold solder bump

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2005, 2005 7th Electronic Packaging Technology Conference.

Combination of Fine Pitch and High Uniformity of Lead-Free Plating-Based Flip Chip Solder Bumps

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2006, 2006 International Conference on Electronic Materials and Packaging.

ANovelPolishing Mechanism UsedinManufacturing Ultra-High Uniformity GoldSolder Bump

Jung-Tang Huang, Pen-Shan Chao, C.-A. Hsiao, 2005 .

A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps

Jung-Tang Huang, Sheng-Hsiung Shih, Hou-Jun Hsu, 2007 .

Using an Innovative Polishing Process to Fabricate Ultra-High Uniformity of Polymer Surface

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2007, Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics.

A Novel Process for Fabricating Ultra-High Coplanarity in Electroplating Lead-Free Copper Pillar Bump

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2008 .

Surface modification on plating-based Cu/Sn/0.7Cu lead-free copper pillars by using polishing

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2008 .

Combination ofFinePitch andHighUniformity ofLead-Free Plating-Based FlipChipSolder Bumps

Jung-Tang Huang, Hou-Jun Hsu, Pen-Shan Chao, 2006 .

Fabrication of high density and high conplanarity lead-free solder bump by a novel process for advanced wafer level packaging

Jung-Tang Huang, Kuo-Yu Lee, Hou-Jun Hsu, 2008, 2008 International Conference on Electronic Materials and Packaging.