Gao Shan

Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

V. Chidambaram, Ho Beng Yeung, Gao Shan, 2012, Journal of Electronic Materials.

Characteristics of shear stress based on magnetorheological fluid flexible fixture during milling of the thin-walled part

Gao Shan, Jiang Xiaohui, Liu Xiao, 2020, The International Journal of Advanced Manufacturing Technology.

Effect of supporting structure design on residual stresses in selective laser melting of AlSi10Mg

Gao Shan, Jiang Xiaohui, Yuan Chunbo, 2021, The International Journal of Advanced Manufacturing Technology.

Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications

V. Chidambaram, Ho Beng Yeung, Gao Shan, 2012, Journal of Electronic Materials.

Comparisons of stress wave propagating velocities in frozen state and in normal temperature state of standing trees.

Gao Shan, Wang Lihai, Wang Yang, 2010 .

Prediction modeling of surface roughness in milling of carbon fiber reinforced polymers (CFRP)

Gao Shan, Jiang Xiaohui, Z. Yong, 2021, The International Journal of Advanced Manufacturing Technology.

Characteristics of shear stress based on magnetorheological fluid flexible fixture during milling of the thin-walled part

Gao Shan, Jiang Xiaohui, Liu Xiao, 2020, The International Journal of Advanced Manufacturing Technology.

High reliability gold based solder alloys for micro-electronics packaging for high temperature applications

V. Chidambaram, Ho Beng Yeung, Gao Shan, 2012, 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Development of Quick-Solidifying Foamed Concrete for Mine Fires Extinguishment and the Basic Performances Tests

Yu Hongdan, Gao Shan, F. Shaojun, 2020, Frontiers in Materials.