Xinmeng Zhai

Effect of the Welding Process on the Microstructure and Mechanical Properties of Au/Sn–3.0Ag–0.5Cu/Cu Solder Joints

Bobo Yang, Jun Zou, Mingming Shi, 2022, Journal of Electronic Materials.

Preparation and reliability of wearable light-storing buttons

Bobo Yang, Jun Zou, Mingming Shi, 2021, Ceramics International.

Impact of different aging conditions on the IMC layer growth and shear strength of Ni-modified MWCNTs reinforced Sn-Ag-Cu composite solder

Xinmeng Zhai, Yue Chen, Yue-Rong Li, 2021, Soldering & Surface Mount Technology.

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures

Bobo Yang, Jun Zou, Mingming Shi, 2021, Journal of Electronic Materials.

Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids

Bobo Yang, Jun Zou, Mingming Shi, 2021, Journal of Electronic Materials.

Effect of Different Soldering Temperatures on the Solder Joints of Flip-Chip LED Chips

Jun Zou, Mingming Shi, Xinmeng Zhai, 2020, Journal of Electronic Materials.

Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging

Bobo Yang, Jun Zou, Mingming Shi, 2022, Soldering & Surface Mount Technology.