E. George

A Lead-Free Transition Plan for Safety and Reliability Critical Products

M. Pecht, E. George, 2022 .

Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications

D. Das, M. Osterman, E. George, 2011, IEEE Transactions on Device and Materials Reliability.

A NON-LINEAR DAMAGE MODEL WITH LOAD DEPENDENT EXPONENTS FOR SOLDERS UNDER SEQUENTIAL CYCLIC SHEAR LOADS

E. George, 2015 .

Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads

M. Pecht, M. Osterman, E. George, 2019, Journal of Electronic Materials.

Fusion prognostics-based qualification of microelectronic devices

Michael Pecht, Elviz George, Arvind Vasan, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

RoHS compliance in safety and reliability critical electronics

Michael G. Pecht, Elviz George, M. Pecht, 2016, Microelectron. Reliab..

High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives

Michael Osterman, Michael Pecht, Elviz George, 2015, Journal of Materials Science: Materials in Electronics.

Physics-of-failure (PoF) methodology for electronic reliability

Michael Osterman, Christopher Hendricks, Michael Pecht, 2015 .