I. Dutta

发表

Praveen Kumar, M. S. Bakir, M. Bakir, 2012, Journal of Electronic Materials.

I. Dutta, Indranath Dutta, J. Dunne, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

I. Dutta, K. Peterson, Chanman Park, 2003 .

R. Mahajan, I. Dutta, J. Pang, 2010, 2010 12th Electronics Packaging Technology Conference.

P. Conway, Tae-Kyu Lee, Zhiheng Huang, 2020 .

A. Bandyopadhyay, V. Balla, S. Bose, 2010 .

B. Majumdar, B. Ye, Tian-dan Chen, 2006 .

Mingwei Chen, I. Dutta, K. Peterson, 2002 .

B. Majumdar, I. Dutta, S. Bhassyvasantha, 2019, JOM.

I. Dutta, U. Sahaym, B. Talebanpour, 2016, IEEE Transactions on Device and Materials Reliability.

V. Gupta, G. Subbarayan, D. Chan, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

I. Dutta, P. Ajay Kumar, P. A. Ajay Kumar, 2018, Journal of Electronic Materials.

R. Raj, J. Liu, I. Dutta, 2009, 2009 11th Electronics Packaging Technology Conference.

J. Liu, I. Dutta, R. Raj, 2009, 2008 Second International Conference on Thermal Issues in Emerging Technologies.

Paul Conway, Indranath Dutta, Praveen Kumar, 2017 .

Peter Borgesen, Praveen Kumar, Uttara Sahaym, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

P. Kumar, C. H. Wen, I. Dutta, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

I. Dutta, B. Talebanpour, Z. Huang, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

R. Mahajan, J. Pang, I. Dutta, 2012, Journal of Electronic Materials.

R. Mahajan, I. Dutta, Z. Huang, 2012, Journal of Electronic Materials.

V. Sarihan, D. Frear, I. Dutta, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

B. Majumdar, I. Dutta, S. Bhassyvasantha, 2017, Journal of Electronic Materials.

G. Subbarayan, Xu Nie, D. Bhate, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

G. Subbarayan, V. Gupta, I. Dutta, 2008, 2008 10th Electronics Packaging Technology Conference.

I. Dutta, N. Fredj, W. Jennings, 2018, Journal of Electronic Materials.

D. Bhate, D. Chan, G. Subbarayan, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

G. Subbarayan, D. Edwards, I. Dutta, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

I. Dutta, U. Sahaym, B. Talebanpour, 2016, IEEE Transactions on Device and Materials Reliability.

D. Chan, G. Subbarayan, V. Gupta, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

B. Majumdar, I. Dutta, S. Das Mahapatra, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

J. Liu, I. Dutta, L. Meinshausen, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Praveen Kumar, I. Dutta, Peiyu Tan, 2020, Engineering Research Express.

Praveen Kumar, I. Dutta, D. Sharma, 2020, Engineering Research Express.

J. Zhao, D. Bhate, D. Chan, 2008, 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

R. Panat, Y. Arafat, I. Dutta, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).