T. Morita
发表
N. Takeda,
T. Ogura,
A. Hirose,
2009
.
Yoshio Kobayashi,
T. Morita,
H. Nakazawa,
2017
.
Yoshio Kobayashi,
T. Morita,
T. Shirochi,
2013
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2016
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2009
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2013
.
H. Kawaji,
T. Morita,
Y. Yasuda,
2014,
Journal of Thermal Analysis and Calorimetry.
Yoshio Kobayashi,
K. Nakashima,
T. Morita,
2019,
SN Applied Sciences.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2013
.
T. Morita,
Y. Yasuda,
Y. Kobayashi,
2020
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2019
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2017
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2015
.
Takuto Yamaguchi,
Akio Hirose,
Eiichi Ide,
2008
.
T. Morita,
M. Hama,
K. Yamamura,
2016
.
Yusuke Yasuda,
Eiichi Ide,
Jiro Ushio,
2010
.
H. Kawaji,
T. Morita,
Shohei Terada,
2012
.
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2017
.
Kazuhiro Suzuki,
T. Morita,
Y. Yasuda,
2014
.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
New Method for Estimating Impact Strength of Solder-Ball-Bonded Interfaces in Semiconductor Packages
T. Morita,
R. Kajiwara,
Satoru Okabe,
2008
.
T. Terasaki,
T. Morita,
Y. Yasuda,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Akio Hirose,
Yusuke Yasuda,
Eiichi Ide,
2008
.
T. Terasaki,
T. Matsuda,
T. Morita,
2019,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2014
.
T. Morita,
T. Maeda,
Y. Yasuda,
2016,
Applied Nanoscience.
Yoshio Kobayashi,
T. Morita,
T. Shirochi,
2013
.
Yoshio Kobayashi,
Takafumi Maeda,
Yusuke Yasuda,
2013
.
Yoshio Kobayashi,
Toshiaki Morita,
Yoshio Kobayashi,
2012
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2010
.
T. Morita,
T. Maeda,
Y. Kobayashi,
2012
.
So Watanabe,
M. Mori,
Taiga Arai,
2017,
2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD).
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2017
.
Kojiro F. Kobayashi,
Akio Hirose,
Yusuke Yasuda,
2008
.
T. Ogura,
A. Hirose,
E. Ide,
2013,
Journal of Electronic Materials.
A. Hirose,
E. Ide,
T. Morita,
2009
.
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2012
.
Low-Temperature Metal–Metal Bonding Process Using Leaf-Like Aggregates Composed of CuO Nanoparticles
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2015
.
E. Ide,
T. Morita,
Y. Yasuda,
2009
.
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2016
.
T. Morita,
Y. Yasuda,
2015
.
T. Morita,
T. Maeda,
Y. Kobayashi,
2012
.
Yoshio Kobayashi,
T. Morita,
T. Maeda,
2014
.
Yoshio Kobayashi,
Toshiaki Morita,
Yoshio Kobayashi,
2011
.
Daisuke Kawase,
Masakazu Sagawa,
Takashi Ishigaki,
2018,
2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).
E. Ide,
T. Morita,
Y. Yasuda,
2013
.
T. Morita,
Y. Yasuda,
E. Ide,
2010
.
A. Hirose,
E. Ide,
T. Morita,
2010
.
J. Onuki,
T. Morita,
M. Suwa,
2001
.
T. Masuda,
N. Tega,
Y. Mori,
2018,
2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe).
E. Ide,
T. Morita,
Y. Yasuda,
2013
.
Yoshio Kobayashi,
T. Morita,
Y. Yasuda,
2016
.
H. Miki,
R. Yamada,
T. Ishigaki,
2018
.
J. Onuki,
T. Morita,
H. Onose,
1999
.