F. Teng

发表

Kun Yu, Yilong Dai, F. Teng, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Kun Yu, Hanqing Xiong, Yilong Dai, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

P. Shen, F. Teng, Shouyu Wang, 2019, Journal of Alloys and Compounds.

Chenpei Yuan, F. Teng, Zailun Liu, 2019, Journal of Alloys and Compounds.