Sun Yaofeng

Study of optimal subset size in digital image correlation of speckle pattern images

Sun Yaofeng, J. Pang, 2007 .

Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias

Rao Tummala, Jianmin Miao, Ritwik Chatterjee, 2008 .

Digital image correlation and its applications in electronics packaging

Su Fei, Tan Yeow Meng, Sun Yaofeng, 2005, 2005 7th Electronic Packaging Technology Conference.