C. Bencher

发表

Flexible Control of Block Copolymer Directed Self‐Assembly using Small, Topographical Templates: Potential Lithography Solution for Integrated Circuit Contact Hole Patterning

H. Wong, S. Mitra, Li-Wen Chang, 2012, Advanced materials.

Experimental demonstration of aperiodic patterns of directed self-assembly by block copolymer lithography for random logic circuit layout

Li-Wen Chang, Xinyu Bao, H.-S. Philip Wong, 2010, 2010 International Electron Devices Meeting.

Understanding device impact of line edge/width roughness in frequency domain

Peng Xie, He Ren, Huixiong Dai, 2013, Advanced Lithography.

Phase transformations in an in situ Nb-reinforced Nb3Al intermetallic composite

R. Ritchie, C. Bencher, L. Murugesh, 1996 .

Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab

William D. Hinsberg, Chris Bencher, Hoa D. Truong, 2011, Advanced Lithography.

Block copolymer directed self-assembly enables sublithographic patterning for device fabrication

H.-S. Philip Wong, He Yi, Chris Bencher, 2012, Advanced Lithography.

Sidewall spacer quadruple patterning for 15nm half-pitch

Ping Xu, Chris Ngai, Yijian Chen, 2011, Advanced Lithography.

Toughening mechanisms in ductile niobium-reinforced niobium aluminide (Nb/Nb3Al) in situ composites

R. Ritchie, K. V. Rao, C. Bencher, 1995 .

22nm half-pitch patterning by CVD spacer self alignment double patterning (SADP)

Warren Montgomery, Huixiong Dai, Christopher Dennis Bencher, 2008, SPIE Advanced Lithography.

Generating sub-30-nm polysilicon gates using PECVD amorphous carbon as hardmask and anti-reflective coating

Wei Liu, Toshihiro Oga, Christopher Dennis Bencher, 2003, SPIE Advanced Lithography.

Self-aligned triple patterning for continuous IC scaling to half-pitch 15nm

Ping Xu, Chris Ngai, Yijian Chen, 2011, Advanced Lithography.

Double patterning combined with shrink technique to extend ArF lithography for contact holes to 22nm node and beyond

Hao Chen, Chris Ngai, Chris Bencher, 2008, SPIE Advanced Lithography.

Double patterning compliant logic design

Yunfei Deng, Harry J. Levinson, Huixiong Dai, 2011, Advanced Lithography.

Gridded design rule scaling: taking the CPU toward the 16nm node

Huixiong Dai, Christopher Dennis Bencher, Yongmei Chen, 2009, Advanced Lithography.

APF pitch-halving for 22nm logic cells using gridded design rules

Michael C. Smayling, Huixiong Dai, Christopher Dennis Bencher, 2008, SPIE Advanced Lithography.

Directed self-assembly defectivity assessment. Part II

Ofir Montal, Kfir Dotan, Joy Cheng, 2012, Advanced Lithography.

45nm and 32nm half-pitch patterning with 193nm dry lithography and double patterning

Huixiong Dai, Chris Ngai, Christopher Dennis Bencher, 2008, SPIE Advanced Lithography.