James F. Burgess

A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology

Michael Gdula, Kenneth Brakeley Welles, Robert J. Wojnarowski, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

Eliminating threshold losses in MOS circuits by bootstrapping using varactor coupling

Joseph L. Mundy, James F. Burgess, R. E. Joynson, 1972 .

Low-cost associative memory

Joseph L. Mundy, James F. Burgess, R. E. Joynson, 1972 .

Eliminating threshold losses in MOS circuits by varactor bootstrapping

Joseph L. Mundy, Constantine Alois Neugebauer, James F. Burgess, 1971 .

Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor Packaging

Constantine Alois Neugebauer, James F. Burgess, Alexander J. Yerman, 1983 .

I‐V characteristics of MOS capacitors with polycrystalline silicon field plates

Constantine Alois Neugebauer, James F. Burgess, R. E. Joynson, 1972 .

Electron trapping in thin SiO2 films due to avalanche currents

Constantine Alois Neugebauer, James F. Burgess, R. E. Joynson, 1972 .