Jui-Hung Chien

Floorplanning 1024 cores in a 3D-stacked networkon- chip with thermal-aware redistribution

Ding-Ming Kwai, Yung-Fa Chou, Chin-Chi Hsu, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

A flexible surface wetness sensor using a RFID technique

Da-Sheng Lee, Ping-Hei Chen, Cheng-Hao Yang, 2008, Biomedical microdevices.

On the futility of thermal through-silicon-vias

Yiyu Shi, Hao Yu, Shih-Chieh Chang, 2013, 2013 International Symposium onVLSI Design, Automation, and Test (VLSI-DAT).

Dynamic Thermal Management for Heterogeneous Multi-Core Processor Throughput Optimization

Cody Hao Yu, Ding-Ming Kwai, Shih-Chieh Chang, 2014 .

TSV fault-tolerant mechanisms with application to 3D clock networks

Yiyu Shi, Shih-Chieh Chang, Jui-Hung Chien, 2011, 2011 International SoC Design Conference.

Three-Dimensional Integrated Circuits Design for Thousand-Core Processors: From Aspect of Thermal Management

Ding-Ming Kwai, Shih-Chieh Chang, Yung-Fa Chou, 2012 .

Contactless stacked-die testing for pre-bond interposers

Shih-Chieh Chang, Jui-Hung Chien, Ka-Yi Yeh, 2014, 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC).

Development of fluorescence computational algorithm for DNA amplification

Ping-Hei Chen, Jui-Hung Chien, Ying-Hao Chu, 2008 .

Cyber physical system (CPS) for contactless IC testing

Shih-Chieh Chang, Jui-Hung Chien, Nien-Tzu Chang, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Package geometric aware thermal analysis by infrared-radiation thermal images

Hao Yu, Shih-Chieh Chang, Jui-Hung Chien, 2014, 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE).

Verification of turning insert specifications through three-dimensional vision system

Jui-Hung Chien, Pei-Ju Chiang, Geng-Hao Ping, 2018 .

Realization of virtual 126-core system with thermal sensor-network using metallic thermal skeletons

Ding-Ming Kwai, Shih-Chieh Chang, Ping-Hei Chen, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).