Jianfeng Li

发表

Testing of a Lightweight SiC Power Module for Avionic Applications

A. Castellazzi, Emre Gurpinar, D. De, 2014 .

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module

Paul L. Evans, R. Skuriat, C. M. Johnson, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Die Attach of Power Devices Using Silver Sintering - Bonding Process Optimization and Characterization

Mark Johnson, Cyril Buttay, H. Morel, 2011 .

Characterization and solderability of cold sprayed Sn-Cu coatings on Al and Cu substrates

Christopher Mark Johnson, C. M. Johnson, D. G. McCartney, 2010 .

Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment

C. M. Johnson, Yun Wang, Shuguang Li, 2014 .

Design of a novel, high-density, high-speed 10 kV SiC MOSFET module

R. Burgos, D. Boroyevich, G. Lu, 2017, 2017 IEEE Energy Conversion Congress and Exposition (ECCE).

Influence of Powders and Process Parameters on Bonding Shear Strength and Micro Hardness in Laser Cladding Remanufacturing

Jibin Jiang, Mingsan Xu, Jianfeng Li, 2015 .

Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process

Christopher Mark Johnson, Pearl Agyakwa, C. M. Johnson, 2010 .

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2014, Journal of Electronic Materials.

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Christopher Mark Johnson, Pearl Agyakwa, C. M. Johnson, 2011 .

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

C. M. Johnson, M. Corfield, Jianfeng Li, 2018, IEEE Transactions on Device and Materials Reliability.

Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires

Li Yang, Christopher Mark Johnson, Pearl Agyakwa, 2013, Journal of Electronic Materials.

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

Jianfeng Li, Jingru Dai, Christopher Mark Johnson, 2018, Microelectron. Reliab..

A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2013 .

Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2012 .

Integrated High Power Modules

P. Evans, C. M. Johnson, Jianfeng Li, 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).

Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

C. M. Johnson, M. Corfield, Jianfeng Li, 2020 .

Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

Cyril Buttay, Christopher Mark Johnson, Stephane Azzopardi, 2015 .

A fixed-grid numerical modelling of transient liquid phase bonding and other diffusion-controlled phase changes

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2010 .

Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects

Alberto Castellazzi, Christopher Mark Johnson, Martin Corfield, 2015, IEEE Transactions on Power Electronics.

A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module

Alberto Castellazzi, Jianfeng Li, Emre Gurpinar, 2018, IEEE Transactions on Power Electronics.

Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2017 .

A thermal cycling reliability study of ultrasonically bonded copper wires

Bassem Mouawad, C. Mark Johnson, Jianfeng Li, 2016, Microelectron. Reliab..

Development of a highly integrated 10 kV SiC MOSFET power module with a direct jet impingement cooling system

Bassem Mouawad, Christina DiMarino, Robert Skuriat, 2018, 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

Hybrid half-bridge package for high voltage application

Bassem Mouawad, Alberto Castellazzi, A. Castellazzi, 2016, 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD).

Dependence of overcurrent failure modes of IGBT modules on interconnect technologies

Jianfeng Li, Christopher Mark Johnson, C. M. Johnson, 2015, Microelectron. Reliab..

Novel Silicon Carbide Integrated Power Module for EV application

Bassem Mouawad, Lee Empringham, C. Mark Johnson, 2018, 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia).

Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure

Jingru Dai, Christopher Mark Johnson, Yan Liu, 2018, IEEE Journal of Emerging and Selected Topics in Power Electronics.

Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior

C. M. Johnson, M. Corfield, Jianfeng Li, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.