P. Agyakwa

发表

Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module

Paul L. Evans, R. Skuriat, C. M. Johnson, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

C. M. Johnson, Li Yang, P. Agyakwa, 2013, IEEE Transactions on Device and Materials Reliability.

Characterization and solderability of cold sprayed Sn-Cu coatings on Al and Cu substrates

Christopher Mark Johnson, C. M. Johnson, D. G. McCartney, 2010 .

Quantitative Microstructure Characterization of Ag Nanoparticle Sintered Joints for Power Die Attachment

C. M. Johnson, Yun Wang, Shuguang Li, 2014 .

Kinetics of Ag3Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process

Christopher Mark Johnson, Pearl Agyakwa, C. M. Johnson, 2010 .

Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2014, Journal of Electronic Materials.

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Christopher Mark Johnson, Pearl Agyakwa, C. M. Johnson, 2011 .

Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling

C. M. Johnson, M. Corfield, Jianfeng Li, 2018, IEEE Transactions on Device and Materials Reliability.

Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires

Li Yang, Christopher Mark Johnson, Pearl Agyakwa, 2013, Journal of Electronic Materials.

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

Li Yang, C. Mark Johnson, J. F. Li, 2011, Microelectron. Reliab..

A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2013 .

Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2012 .

Integrated High Power Modules

P. Evans, C. M. Johnson, Jianfeng Li, 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).

Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling

Jian Feng Li, Wei-Sun Loh, C. M. Johnson, 2010, IEEE Transactions on Device and Materials Reliability.

Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process

C. M. Johnson, M. Corfield, Jianfeng Li, 2020 .

A fixed-grid numerical modelling of transient liquid phase bonding and other diffusion-controlled phase changes

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2010 .

Degradation of thermal interface materials for high-temperature power electronics applications

C. Mark Johnson, J. F. Li, Pearl A. Agyakwa, 2013, Microelectron. Reliab..

Mark (2016) Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”. Intermetallics, 69 . pp. 128-130. ISSN 0966-9795

C. M. Johnson, P. Agyakwa, J. Li, 2016 .

Response to comments on “ A numerical method to determine interdiffusion coefficients of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds ”

C. M. Johnson, P. Agyakwa, J. Li, 2016 .

Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement

Li Yang, C. Mark Johnson, Pearl A. Agyakwa, 2016, Microelectron. Reliab..

Time-Efficient Sintering Processes to Attach Power Devices Using Nanosilver Dry Film

C. M. Johnson, Jianfeng Li, P. Agyakwa, 2017 .

A thermal cycling reliability study of ultrasonically bonded copper wires

Bassem Mouawad, C. Mark Johnson, Jianfeng Li, 2016, Microelectron. Reliab..

Methodology for identifying wire bond process quality variation using ultrasonic current frequency spectrum

C. Mark Johnson, Pearl Agyakwa, Elaheh Arjmand, 2013, 2013 15th European Conference on Power Electronics and Applications (EPE).

Creep and microstructural development in P91 weldments at elevated temperature

P. Agyakwa, 2004 .

Anisotropic Creep and Fracture Behaviour of a 9CrMoNbV Weld Metal at 650°C

Thomas H. Hyde, P. H. Shipway, J. A. Williams, 2003 .

Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules

C. M. Johnson, M. Corfield, P. Agyakwa, 2019, Journal of microscopy.

Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

C. Mark Johnson, Elaheh Arjmand, Pearl A. Agyakwa, 2014, Microelectron. Reliab..

Packaging degradation studies of High Temperature SiC MOSFET discrete packages

C. M. Johnson, Li Yang, M. Corfield, 2020, 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD).